1. 2. 3. material content data sheet sales product name ipb80n06s2l-09 issued 29. august 2013 ma# MA000275630 package pg-to263-3-2 weight* 1464.20 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 5.888 0.40 0.40 4021 4021 leadframe non noble metal iron 7439-89-6 0.853 0.06 582 inorganic material phosphorus 7723-14-0 0.256 0.02 175 non noble metal copper 7440-50-8 851.691 58.16 58.24 581679 582436 wire non noble metal aluminium 7429-90-5 5.287 0.36 0.36 3611 3611 encapsulation organic material carbon black 1333-86-4 8.791 0.60 6004 plastics epoxy resin - 96.706 6.60 66047 inorganic material silicondioxide 60676-86-0 480.601 32.82 40.02 328235 400286 leadfinish non noble metal tin 7440-31-5 9.657 0.66 0.66 6595 6595 plating non noble metal nickel 7440-02-0 0.228 0.02 156 inorganic material phosphorus 7723-14-0 0.001 0.00 0.02 0 156 solder noble metal silver 7440-22-4 0.106 0.01 72 non noble metal tin 7440-31-5 0.085 0.01 58 non noble metal lead 7439-92-1 4.049 0.28 0.30 2765 2895 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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